ASAP-1
ARC-lite
INFRATEC-1
ASAP-decap
ULTRASPEC-III
FA Product Catalog - low res (pdf) & high res (pdf)
SAP Consumables Selection Guide (pdf)
ASAP-1 Upgrades & Retro-fits (pdf)
INFRATEC-1 Datasheet (pdf)
"Enabling Failure Analysis" Newsletter
ISSUE 6 Summer 2006 Edition (pdf)
ISSUE 5 Summer 2005 Edition (pdf)
ISSUE 4 Winter / Spring 2004 Edition (pdf)
ISSUE 3 Summer 2003 Edn. (pdf) + (low res)
ISSUE 2 Winter 2002 / Spring 2003 Edn. (pdf) + (low res)
ISSUE 1 Summer 2002 Edn. (pdf) + (low res)
Recent Papers & Articles
ISTFA, Nov 2004: Topside De-layering Trials with a Rotating Polishing Tool (pdf)
MATERIALS WORLD, Nov 2003: Microsurgery for Microchips (pdf)
ADVANCED PACKAGING, Dec 2003:Microsurgery on Microchips (pdf)
TEC Notes
TEC NOTE #6: Improved de-processing of multilayer devices with optical alignment techniques(pdf)
TEC NOTE #5: Tunnel Decap Method for Topside of wire-bonded packages (pdf)
TEC NOTE #4: New Mechanical Decapsulation Techniques for CSP's (pdf)
TEC NOTE #3: Producing extremely thin substrates... (pdf)
TEC NOTE#2: The importance of low damage sample preparation (pdf)
TEC NOTE#1: Selected Area Polishing - FAQ (pdf)
Applications
Partial list of sample types that have benefited from Selected Area Preparation (pdf)
ASAP-1 Application Shots - PACKAGE LEVEL COMPONENTS
ASAP-1 Application Shots - WAFER LEVEL COMPONENTS
ASAP-decap - Chem-mech - DECAP EXAMPLES
Backside Images
Backside Images 1.After SAP & 2. After ARC
MULTIMEDIA
Silicon Removal Process Video (Note: AVI Video format)
"Enabling Failure Analysis" (Powerpoint Presentation)- ask for a copy on CD-ROM or DOWNLOAD HERE
Other Resources
Report on AR Imaging Effectiveness using FAI Emission System(pdf)
See the process route for backside preparation
