|
|
 Chip access, decapsulator, decapsulation, acid decapsulation, topside, jet-etching, dual-acid, laser ablation, pre-cavitation, counterfeit parts, repackaging components, plasma decapsulation, counterfeit protection, nitric acid, sulfuric acid, product teardown, gasket milling, fillerblast, de-lidding, delidding |
|
ULTRA TEC offers an unsurpassed portfolio of chemical, laser , mechanical and plasma systems for the decapsulation of packaged devices.
CHEMICAL DECAPSULATION RAPIDETCH Chemical Decapsulators are available in dual and single (or pre-mixed) configurations.
Etches precise openings in plastic packages of all sizes and compositions. Advanced pumping principle offers benefits in acid control, safety etc. Market-leading speeds for etch head heating & cooling. This provides maximum uptime when changing acid mixes and package types. New techniques allow for low oxidation and improved survivability of, for example, copper bond wires.
PLASMA DECAPSULATION
FA-2000 incorporates a special in-line C02 Fillerblast manifold provides previously unheard-of removal rates in plasma decapsulation. Plasma provides an unique final step for many emerging applciations.
LASER DECAPSULATION
SESAME 1000 provides encapsulant removal from ALL types of packaged device. Decapsulation and Cross-sectioning of PCB's. Machining of custom fixtures and gaskets for RAPIDETCH and other chemical decapsulation systems.
MECHANICAL DECAPSULATION
ASAP-1 produces parts with vertical walls & unmatched control of material removal depth. This helps ensure the electrical survivability. Mechanical decapsulation offers key advantages for several performance issues seen with chemical-only approaches. For instance, thick packages are just as effective to decap as thin packages; very small cavities can be opened; and traditionally 'difficult' materials may be processed or pre-cavitated quickly and easily by mechanical means.
For hermetic seals and related requirements (shown above on a ceramic PGA), ULTRASLICE saw offers the means to easily delid and decapsulate. This is made possible with ULTRASLICE's unique 'Z-spindle' which provides 'on the fly' control of the blade depth for fine tuning precision slices.
Equipment Selection Guide
click image above to enlarge - full details available on request Our engineers are on hand to help to optimize your decapsulation application requirements.
|Main| |Equipment| |Consumables| |Notes & Articles| |What's New| |
