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Key
Industry Literature
 
PARALLEL
POLISHING &
X-SECTIONING
Rapid, convenient, and
reproducible saw cuts can be made with ULTRASLICE or
ULTRATRIM
precision saws to reveal hidden defects,
after subsequent lapping and polishing.
ULTRAPOL
Advance
offers the ability for high quality
samples preparations, whether topside, backside or cross-section.
New upgrades to ASAP-1
also
allow for topside de-processing, with the addition of an ULTRACOLLIMATOR.
BACKSIDE PREPARATION (see
SAP Resource Page)
The increasing number
metallization layers seen in modern IC’s means topside techniques
are inadequate for analysis. This has
caused a movement of failure analysis to be
performed from the back-side of the die, as opposed to
traditional topside work. The use of backside
emission analysis, i.e. analysis of emission sites within
die circuitry through the silicon substrate that appears
transparent at near-infra-red wavelengths, generally calls for
the planar thinning, and subsequent polishing, of the silicon substrate, to make
imaging and thus backside emission analysis possible.
Backside
Image (showing 2 emission sites)
ASAP-1
brings this operation to a new
level of accuracy, reproducibility and convenience.
DECAPSULATION
-- click here
for resources
ULTRA TEC offers an unsurpassed
portfolio of chemical, mechanical, plasma and
laser systems for the decapsulation of packaged devices.
RAPIDETCH
Chemical Decapsulators are available in dual and single (or
pre-mixed) configurations.
Mechanical decapsulation offers key
advantages for several performance issues seen with chemical-only
approaches. For instance, thick packages are just as easy to decap as
thin packages; very small cavities can be opened; and traditionally
'difficult' materials may be processed quickly and easily by
mechanical means.
ASAP-1
produces parts with vertical walls &
unmatched control of material removal depth. This helps ensure the
electrical survivability of decapsulated parts.
ANTI-REFLECTIVE
COATING (ARC)
Anti-reflective coating is a necessary
sample preparation step for many backside techniques, which is
performed after Selected Area Preparation and polishing. The ARC-lite
system provides a fast, convenient, room temperature solution for
producing ARC's on packaged devices.
UV, Color & BACKSIDE MICROSCOPY
ICis Materials
Inspection System is
the first microscopy system designed with the sample preparation
professional in mind.The system
incorporates an advanced illumination and integration system and can
accept workholders directly from ASAP-1.
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1025 E. Chestnut Ave.
Santa Ana, CA 92701-6425
TOLL FREE (US): 1 877 542 0609
Tel: (714) 542-0608
Fax: (714) 542-0627
Email:
info@ultratecusa.com
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|Main|
|Equipment| |Consumables| |Notes & Articles| |What's
New|
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LIVA, Phton emission microscope,microcleaving, TIVA, KIVA, XIVA, OBIRCH, IR-OBIRCH, PICA, FMI,
LSM, SIFT, IDS, FIB, lSM, laser scanning microscope, PEM, SEM
